Superconducting Chip Design Internship H/F

🇫🇷 Paris, France
Posted 2 weeks ago
Expires June 23, 2026
InternshipHybridEngineeringProduct

Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems.
The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈‍⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously!
 
We're a diverse team of 140+ brilliant minds from over 20 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together!

Superconducting qubits with the highest possible lifetimes are crucial for ensuring that quantum states within a QPU persist long enough for quantum algorithms to run successfully. The lifetime of a qubit depends on two main contributions: external loss, which arises from coupling between the qubit and the RF environment; and internal loss, which results from interactions between the qubit’s electromagnetic fields and the surrounding materials near the qubit.
 
While external loss, though challenging, can be directly simulated using Finite Element Method (FEM) tools, internal loss requires a deep understanding of material properties and surface effects at the microscopic level, as well as the development of advanced analysis methods to accurately capture their impact in simulations. To achieve the highest possible qubit lifetime, it is essential to minimize both types of loss.

As an intern with the Design & Implementation team, you will work on the design and simulation of a testbed aimed at quantifying the sources of internal loss and their distribution across materials and interfaces surrounding the qubit. You will perform FEM simulations to design both the package and the embedded chips, while also developing a measurement plan and analysis methodology to...

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