Quantum Advanced Packaging Engineer
ABOUT US
QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors.
With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time. That’s where you come in!
As an Advanced Packaging Engineer for quantum technologies you will lead a critical part of the research and development of our chiplet technologies and 3D architecture system for scalable quantum computing processors. You’ll work as part of a multidisciplinary R&D team responsible for designing, fabricating, prototyping, assembling, and testing the critical building blocks of a novel 3D architecture for next-generation quantum computers. In this role, you will drive and guide the development of our chip layers from concept to implementation, playing a key role in advancing our quantum hardware platform.
WHAT YOU’LL BE DOING:
- Drive R&D activities from early concept through prototyping to manufacturable processes - including contributing hands-on - to new packaging and assembly techniques, using novel fabrication methods, and assembly techniques and tools.
- Lead, mentor, and inspire development of advanced packaging techniques for quantum hardware applications.
- Collaborate with external partners and vendors, managing outsourced activities and ensuring seamless integration of external technologies into our products.
- Allocate resources and time strategically, balancing workload across different development activities, coordinating cross-functional contributions, and aligning priorities with company objectives.
- Foster a culture of innovation and accountability, ensuring the team delivers technical excel...